2

Impact of component placement in solder joint reliability

Year:
2002
Language:
english
File:
PDF, 269 KB
english, 2002
14

Solder bump reliability-issues on bump layout

Year:
2000
Language:
english
File:
PDF, 98 KB
english, 2000
15

Modeling and Analyzing Vertical Interconnections

Year:
2006
Language:
english
File:
PDF, 783 KB
english, 2006
16

Stacked Modular Package

Year:
2004
Language:
english
File:
PDF, 1.20 MB
english, 2004
17

Mechanical properties of nanoscale copper under shear

Year:
2000
Language:
english
File:
PDF, 359 KB
english, 2000
28

Anisotropic conductive film flip chip joining using thin chips

Year:
2002
Language:
english
File:
PDF, 212 KB
english, 2002
29

Flip chip attachment on flexible LCP substrate using an ACF

Year:
2005
Language:
english
File:
PDF, 308 KB
english, 2005
30

Strength of Ta–Si interfaces by molecular dynamics

Year:
2003
Language:
english
File:
PDF, 119 KB
english, 2003
33

Balancing temperature dependence of on-wafer SOS inductors

Year:
2006
Language:
english
File:
PDF, 274 KB
english, 2006
34

Reducing bonding cycle time of adhesive flip chip process

Year:
2003
Language:
english
File:
PDF, 376 KB
english, 2003
39

Study of adhesive flip chip bonding process and failure mechanisms of ACA joints

Year:
2004
Language:
english
File:
PDF, 489 KB
english, 2004
42

Specimen stage for air-sensitive materials

Year:
1986
Language:
english
File:
PDF, 95 KB
english, 1986
44

Solder balling of lead-free solder pastes

Year:
2002
Language:
english
File:
PDF, 1.29 MB
english, 2002